Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies
Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a ...
eTeknix1 个月
SK Hynix to Manufacture 3nm HBM4 Chips at TSMC for NVIDIA
The main customer for SK Hynix’s HBM4 memory chips will be NVIDIA ... With the leap from a 5-nanometer process to 3 nanometers, SK Hynix expects to see a performance and efficiency boost ...