来自MSN13 小时
UF 120LA: The Next-Generation High Reliability, 100% Flux Residue Compatible and Reworkable ...
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...
来自MSN1 个月
LG Innotek starts mass production of FC-BGA chip substrate for U.S. clients
LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor substrate targeting tech firms in the United States. “We have begun mass production of FC ...
The Korea Herald26 天
LG Innotek starts mass production of advanced chip substrates as key growth driver
LG Innotek, South Korea’s leading camera module maker, has started the mass production of flip-chip ball-grid array ... The global FC-BGA market is expected to double from $8 billion in 2022 ...