Engineers can design a thermal management system that meets their requirements by evaluating the tradeoffs of cooling devices ...

After measuring the three chips with his digital calipers he cut out the footprint he needed, resulting in three smaller heat sinks. We didn’t realize that thermal compound has enough gripping ...

Graphene Manufacturing Group Ltd. ("GMG") is pleased to provide a business update on the commercialization progress of ...

GMG continues to make progress in testing with companies in multiple industries for the use of THERMAL-XR® in their products, including on heat sinks for electronics. Figure 1 shows an aluminium ...

During the production process, the glass used for windshields is subjected to temperatures as high as 400 °C in the gravity ...

Kyocera AVX has expanded its CR series of high-power chip resistors with a device that handles 2.5 W in a small 0603 package.