As with many inventions, two people had the idea for an integrated circuit at almost the same time. Transistors had become commonplace in everything from radios to phones to computers, and now ...

There are a variety of IC packages for IC sockets and headers. Examples include ball grid array (BGA), chip scale package (CSP), single in-line package (SIP), dual in-line package (DIP), plastic ...

BGA Ball-grid array (BGA) places output pins in a solder ball matrix ... CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated ...