The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

Standard NAND flash storage is used in microSD cards, USB drives, and solid-state drives in computers and phones. To fit more gigabytes into smaller spaces, manufacturers ...

To improve data storage, researchers are perfecting 3D NAND flash memory, which stacks cells to maximize space. Researchers ...

If you override memory cells and thereby delete information ... us to stack compute layers on top of each other and build truly 3D chips. Microprocessors today are 2D because if you stack them, they ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

The project demonstrated large memory bandwidth of 3D stacking architecture which is up to 63 Gb/s. Inter core communication is achieved using 4 buffers architecture in each core to their neighbouring ...

The narrow, deep holes required for one type of flash memory are made twice as fast with the right recipe, which includes a plasma made from hydrogen fluoride.

AMD's next-gen GPUs may upgrade to GDDR7 memory. Future products include Zen 6 CCD and Halo APU with 3D stacking, and PlayStation 6 may feature Zen 5 CPU and UDNA GPU with 3D V-Cache. AMD's next ...

Yangtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as well as 232 active layers, and analysts from TechInsights have managed to ...