In 2023, it is expected that the global panel level packaging market will be worth USD 2.1 billion. By 2033, the market is ...

Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out ...

Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Fan-out packaging on a large square panel is significantly more ...

Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, ...

Flat-panel display maker Innolux Corp (群創) yesterday said it is stepping up investment on developing panel-level packaging ...

TOKYO, JAPAN / ACCESSWIRE / December 9, 2024 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi ...

Manz RDL solutions take a deep dive into panel-level packaging and TGV process. According to Robert Lin, General Manager of Manz Asia, the company latest Redistribution Layer (RDL) process ...

The report explores key trends in 2.5D packaging materials and process flow, as well as the innovative Cu-to-Cu hybrid ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...

HONG KONG SAR - Media OutReach Newswire - 9 December 2024 - Toray Engineering Co.,Ltd has developed the "TRENG-PLP Coater", a high-accuracy coating device for panel level packaging (PLP is an advanced ...