MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in ... and attracts residents and businesses alike.” This announcement comes just days after ...

The U.S.-made chips, used in the defense, AI, automotive, aerospace and communications industries, aim to move packaging production away from Asia, according to the release. The center will ...

Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.

and attracts residents and businesses alike. GlobalFoundries makes chips that use both photons and electrons on chips, and the new chip-packaging-and-testing center will be used to test ...

The tech integrates 2.5D packaging technology ... of the custom ASIC business at Broadcom. To do the integration, Broadcom said it plans to use TSMC's CoWoS (Chip on Wafer on Substrate) technology ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards to strengthen ...