In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

Of course, having a good PCB with good registration markings will ... A gentle push from a hot air gun will push the solder balls over the melting edge. Even taking the part off the hotplate ...

Now, the PCB was ready for a fresh squirt of flux ... IC in place – frequently push-testing the IC to see when its solder balls had joined up with the corresponding pads thanks to cohesive ...

TopLine is a pioneer in CGA Solder Columns Technology and Low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of Bonding Wire for many semiconductor uses and for EV ...