A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.

Also called a "solder bump." See BGA. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction requires permission.

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

ATLANTA, GA / / January 9, 2025 / For the first time, TriChipLink Technology, developed by DUJUD, enables chip designers to ...

Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process View Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder ...

View DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process full description to ...

This guy. There’s something scientifically devious about the way solder smoke heat-seeks to your nostrils. There’s more than one way to strip 16-bit audio down to five. And those nuclear tests ...