A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

Wire bonds exhibit large electrical parasitics, while flip-chip-bonded solder bumps are prone to mechanical failures, particularly in heat-dissipating microchips. TriChipLink eliminates these issues ...