TSMC estimates that the fab will have the capacity to produce more than 1 million 12-inch wafer equivalent 3DFabric process technology per year, and more than 10 million hours of testing services per ...

SAN JOSE, Calif.— September 26, 2024-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.