For instance, Longi introduced 182 mm by 183.75 mm wafers using triangle ribbon and flat ribbon segmentation, and JA Solar launched 182 mm by 185.3 mm pieces using gapless flexible interconnection ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?