Forward-looking: The Department of Commerce has announced $1.4 billion in awards through the CHIPS National Advanced Packaging Manufacturing Program. While this initiative will contribute to ...

GlobalFoundries is now planning to build a $575 million chip packaging and testing center at the site as well. GlobalFoundries CEO Thomas Caulfield, left, and Gov. Kathy Hochul, right, stop for a ...

GlobalFoundries now plans to build a first-of-its-kind advanced chip Packaging and Photonics Center right here in the Capital Region. I’m proud to deliver this additional $75 million ...

Huang explained the transition in Nvidia's chip packaging requirements. "As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will use ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards to strengthen ...

The most advanced AI chips in data centers can no longer fit on one monolithic slab of silicon. Instead, they consist of chiplets lashed together with 2.5D or 3D advanced packaging that get ...

The project will create 102 new full-time jobs over the next five years and further expand GlobalFoundries’ capabilities in advanced chip packaging, an essential part of semiconductor production. The ...

GlobalFoundries will invest $575 million to build an advanced chip packaging and testing center at its Fab 8 campus in Malta, creating 102 jobs. Supported by $95 million in federal and state grants, ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards ...

and Samsung Electronics Co. are among the companies affected. The rules also apply to chip packaging providers. Chip packaging is the technology used to assemble multiple silicon dies into a ...