In 2023, it is expected that the global panel level packaging market will be worth USD 2.1 billion. By 2033, the market is ...

Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out ...

TOKYO, JAPAN / ACCESSWIRE / December 9, 2024 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi ...

Flat-panel display maker Innolux Corp (群創) yesterday said it is stepping up investment on developing panel-level packaging ...

Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray Engineering") has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging ...

Implementing inline inspection and adaptive process control systems, supported by machine learning algorithms, can provide ...

Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, ...