The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards to strengthen ...
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said ...
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...
a world leader in the design of AI chips, reinforcing the companies’ partnership in the production of advanced AI chips. SPIL is a leader in semiconductor packaging and testing. “The technology that ...
allegations that the US dumps lower-end chips and unfairly subsidizes its own chipmakers, in potentially one of Beijing’s strongest retaliatory moves against American technology sanctions.
TAIPEI/NEW YORK -- The U.S. unveiled new measures targeting the global semiconductor sector on Wednesday that further restrict top chipmakers TSMC and Samsung as well as top chip packaging ...
The most advanced AI chips in data centers can no longer fit on one monolithic slab of silicon. Instead, they consist of chiplets lashed together with 2.5D or 3D advanced packaging that get ...
And that might be a controversial decision. Golden has the production you look for from players coming out of a blue-chip program -- he led the Longhorns this season with 987 receiving yards and 9 ...
Today, the US announced new rules to prevent chips from ending up in China or Russia, including requiring more scrutiny of customers by manufacturers, restricting exports to 16 more Chinese ...
It’s not uncommon to see major chip players introduce new and novel approaches to traditional computing paradigms at CES in Las Vegas in January. And if ever there was a limelight moment in that ...