Unaudited translation, provided for reference only DISCO Corporation (FY2024 1Q) (Millions of yen) Three months ended Three months ended 30-Jun-23 30-Jun-24 Net sales 53,961 82,799 Cost of sales 18,779 25,100 Gross profit 35,182 57,699 Selling, general and administrative expenses 18,209 24,322 Operating profit 16,972 33,376 Non-operating income

Guarantee policy for customer using DISCO Products This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer.

*For the revised dividends forecast, refer to the "DISCO Dividend Payout for Fiscal Year 2024" announced on October 17, 2024. *The year-end dividends for fiscal year 2024 have not been determined at this point.

2024年7月18日 · DISCO's ability to continue to offer products and services corresponding to developments of new semiconductors and/or electronic components and new technologies for manufacturing them; (vi) exchange rates, particularly between the yen, the U.S. dollar, and the euro, and other currencies.

We are pleased to announce that the 85th General Shareholders Meeting for DISCO CORPORATION (the “Company”) will be held as described below. If you are unable to attend the meeting in person, you may exercise your voting rights via the internet, etc.

Since FY2014, DISCO has been calculating the amount of greenhouse gas emissions generated by activities that surround the company's entire supply chain. In FY2023, DISCO’s entire supply chain generated 1,128 thousand t-CO

The original quality file is available on DISCO e-Learning Campus (a web service for DISCO customers only). If you are a DISCO customer and wish to obtain the original quality file but have not signed-up for DISCO e-Learning Campus, please contact your nearest DISCO Affiliate Office. PrecisionProcessing Tools DISCO Corporation Training Center ...

Most DISCO equipment is customized to meet our customers’ wide-ranging requirements regarding not only device quality and equipment productivity, but also effective use of space and low environmental impact. DISCO will continue to evolve our core technologies of …

DISCO Technical Review Feb. 2016 2 Die backside after standard process (single cut) Die backside after DBG Through these processes, memory chips used in smartphones and tablets can now be thinned to below 100 µm. However, wafers and chips are sometimes broken in the manufacturing process, which deteriorates the yield. Therefore,

disco corporation To clarify the Company's stance on prioritizing shareholder returns, the target dividend payout ratio has been set at 25% of the consolidated half-yearly net income under a performance-linked dividend policy.