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GaN Systems - GaNpx Packaging Process Flow | GaN Systems

GaN Systems - GaNpx Packaging Process Flow | GaN Systems

GaNpx packaging provides extreme speed and current with: 1) a near chipscale embedded package, 2) high current density & low profile, 3) optimal thermal performance, 4) extremely low inductance, and 5) no wirebonds. GaN Systems makes it easy for designers and systems engineers to adopt gallium nitride solutions.

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Intel Leads the Way with Advanced Packaging

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